As a pioneer in domestic dispensing systems, jetting technology, and surface coating, Xinnuo has independently developed a series of precision dispensing and surface coating systems widely used in SMT and PCB assembly, semiconductor packaging, LED packaging, electromechanical assembly, flat panel display assembly, etc. They are also an alternative for new energy applications, life sciences, and military product dispensing and coating, making Xinnuo the preferred partner for precision dispensing, filling, and coating.

The Xinnuo dispensing and filling system features precision and high-speed dispensing and filling. It adopts a jetting-type quantitative material supply, eliminating the need for Z-axis lifting during operation. This breaks away from traditional contact dispensing, resolving issues such as tailing, uneven glue volume, and damage to components and products, greatly improving work efficiency and product quality. Equipped with powerful functional modules and flexible application, it is the preferred equipment for precision dispensing and filling.

The dispensing system offers significant cost-performance advantages, featuring reliable durability and a streamlined design suitable for various specifications of circuit boards and substrates. Equipped with a simple and user-friendly operating software, it ensures stable and reliable system performance. This system is designed for dispensing applications on chip packaging, red glue, circuit board assembly, medical products, etc. The adjustable track width accommodates a wider range of products. Xinnuo has established an extensive support and service network nationwide, providing complete process solutions for customer development, manufacturing, and product innovation.

✔ Mature and stable high-speed motion platform.

✔ Overall stability design ensures more pronounced reliability advantages with long-term use.

✔ Non-contact jetting dispensing, no Z-axis lifting required.

✔ Automatic constant temperature control ensures consistent paint fluidity.

✔ Online monitoring of dispensing volume.

✔ In-line conveyor system, capable of communication with other equipment.

✔ Precision vision positioning and automatic visual inspection system.

✔ Can be equipped with jetting valves, screw valves, and pneumatic valves as needed.

✔ Modular design allows for flexible integration of optional features.

✔ High-speed jetting, up to 200 points per second.

✔ Freely adjustable dot size, with a minimum dispensing pitch of 0.2mm.

✔ Non-contact jetting valve enables smaller dispensing dot diameters and a wider range of applications.

✔ Minimum single dot diameter up to 250 micrometers.

✔ Maximum paint viscosity up to 250,000 CPS.

✔ Minimum single dot volume up to 0.015mg.

✔ High cost-performance ratio under high-performance conditions.

✔ Improves dispensing consistency, reduces material waste, eliminates tailing, and enhances production capacity and yield rate.

✔ Easy-to-use control software with straightforward programming.

✔ Jetting valve improves dispensing reliability, consistency, and enhances production capacity and material utilization.

✔ Identifies the chip body itself, offering more precise positioning than Mark point recognition.

✔ Features such as identity recognition, automatic program recall, fool-proofing, and data statistics enable smart manufacturing.