As a pioneer in domestic dispensing system, jetting technology, and surface coating, Xinnuo has independently developed a series of precision dispensing and surface coating systems widely used in SMT and PCB assembly, semiconductor packaging, LED packaging, electromechanical assembly, flat panel display assembly, etc. They are also an alternative for new energy applications, life sciences, and military product dispensing and coating, making Xinnuo the preferred partner for precision dispensing, filling, and coating.

The Xinnuo dispensing system features precision high-speed dispensing and filling capabilities, resolving issues such as tailing, uneven glue volume, and damage to components and products, greatly improving work efficiency and product quality. Equipped with powerful functional modules and flexible application, it is the preferred equipment for precision dispensing and filling.

The dispensing system offers significant cost-performance advantages, featuring reliable durability and a streamlined design suitable for various specifications of circuit boards and substrates. Equipped with a simple and user-friendly operating software, it ensures stable and reliable system performance. This system is designed for dispensing applications on chip packaging, adhesives, circuit board assembly, medical products, etc. The adjustable track width accommodates a wider range of products. Xinnuo has established an extensive support and service network nationwide, providing complete process solutions for customer development, manufacturing, and product innovation.

✔ Mature and stable large-size, extra-wide high-speed motion platform.

✔ Both dual-X and dual-Y axes are driven by linear motors.

✔ Dual-valve independent operating system enables segmented and independent motion operation.

✔ Extra-large stroke: Length 1300mm × Width 700mm.

✔ Overall stability design ensures more pronounced reliability advantages with long-term use.

✔ In-line conveyor system, capable of communication with other equipment.

✔ Precision vision positioning and automatic visual inspection system.

✔ Can be equipped with jetting valves, screw valves, and pneumatic valves as needed.

✔ Modular design allows for flexible integration of optional features.

✔ High-speed jetting, up to 100 points per second.

✔ Enables smaller dispensing dot diameters and a wider range of applications.

✔ Minimum single dot diameter up to 300 micrometers.

✔ Minimum single dot volume up to 0.025mg.

✔ High cost-performance ratio under high-performance conditions.

✔ Improves dispensing consistency, reduces material waste, eliminates tailing, and enhances production capacity and yield rate.

✔ Easy-to-use control software with straightforward programming.

✔ Identifies the chip body itself, offering more precise positioning than Mark point recognition.

✔ Features such as identity recognition, automatic program recall, fool-proofing, and data statistics enable smart manufacturing.