As a pioneer in domestic dispensing systems, jetting technology, and surface coating, SINUO has independently developed a series of precision dispensing and surface coating systems widely used in SMT and PCB assembly, semiconductor packaging, LED packaging, electromechanical assembly, flat panel display assembly, etc. They also serve as alternatives for new energy applications, life sciences, and military product dispensing and coating, making SINUO the preferred partner for precision dispensing, filling, and coating.

The SINUO dispensing and filling system features precision and high-speed dispensing and filling. It adopts jetting-type quantitative material supply and operates without Z-axis movement during operation, breaking through traditional contact dispensing methods and eliminating defects such as trailing, inconsistent adhesive volume, and damage to components and products. This significantly improves work efficiency and product quality. Equipped with powerful functional modules and flexible application, it is the ideal equipment for precision dispensing and filling.

The dispensing system offers a distinct cost-performance advantage, being reliable, durable, and designed with a streamlined structure suitable for a wide range of circuit boards and substrates. Equipped with simple and user-friendly operating software, the system ensures stable and reliable performance. Designed for dispensing applications such as chip packaging, red adhesive, circuit board assembly, and medical products, the track width is adjustable to accommodate a broader range of products. SINUO has established an extensive support and service network across the country, providing complete process solutions for customer development, manufacturing, and product innovation.

✔ Mature and stable high-speed motion platform.

✔ Overall stability design ensures more pronounced reliability advantages with long-term use.

✔ Non-contact jetting dispensing with no Z-axis movement required.

✔ Automatic temperature control ensures consistent material fluidity.

✔ Online monitoring of dispense volume.

✔ In-line conveyor system allows communication with other equipment.

✔ Precision vision alignment and automatic visual inspection system.

✔ Unaffected by substrate warpage.

✔ Compatible with jetting valves, screw valves, and pneumatic valves as options.

✔ Modular design allows flexible addition of optional features.

✔ High-speed jetting, up to 200 points per second.

✔ Adjustable dot size with a minimum jetting spacing of 0.18 mm.

✔ Non-contact jetting valve enables smaller dispense diameters and broader application fields.

✔ Minimum single dot diameter可达 250 microns.

✔ Maximum material viscosity可达 250,000 CPS.

✔ Minimum single dot volume可达 0.015 mg.

✔ High cost-performance ratio under high-performance conditions.

✔ Improves dispensing consistency, reduces material waste, eliminates trailing, and enhances throughput and yield.

✔ Control software is easy to operate and program.

✔ Jetting valve improves dispensing reliability, consistency, and enhances throughput and material utilization.

✔ Recognizes the chip body for more precise positioning than Mark point recognition.

✔ Features identity recognition, automatic program recall, fool-proofing, and data statistics for intelligent manufacturing.