Fully automatic high-speed visual dispensing machine X1

Equipment Applications Underfill, FPC encapsulation, SMT red adhesive dispensing, LED packaging, component encapsulation, solder paste dispensing, red adhesive dispensing, black adhesive dispensing, semiconductor packaging, surface mounting, precisio...

Fully automatic high-speed visual dispensing machine X2

Equipment Applications Underfill, FPC encapsulation, SMT red adhesive dispensing, LED packaging, component encapsulation, solder paste dispensing, red adhesive dispensing, black adhesive dispensing, semiconductor packaging, surface mounting, precisio...

Fully automatic linear motor high-speed dispensing machine X3

Equipment Applications Underfill, FPC encapsulation, SMT red glue dispensing, LED encapsulation, component encapsulation, solder paste dispensing, red glue dispensing, black glue dispensing, semiconductor packaging, surface mount technology, precisio...

Fully automatic high-speed dual-X, dual-Y, dual-Z dual-valve independent-motion dispensing machine X5

Equipment Applications Underfill, FPC encapsulation, SMT red glue dispensing, LED encapsulation, MINI LED dispensing, component encapsulation, adhesive dispensing, semiconductor packaging, surface mount technology, precision coating, wafer fixing, etc.